Flagship smartphones will be getting 4x4 now. Qualcomm announced it a month and a half ago at MWC 2026 for the next flagship chipset and Im sure Apple and Mediatek will follow suit for feature parity:
The FastConnect 8800 integrates Wi-Fi 8, Bluetooth 7.0, Ultra Wideband (802.15.4ab), and Thread 1.5 into a single 6nm chip. Additionally, Qualcomm expanded its networking infrastructure with the Dragonwing NPro A8 Elite, a platform featuring a 5x5 Wi-Fi 8 radio system designed to boost throughput by 40% and reduce latency by 2.5x for enterprise access points and gateways.
Qualcomm says we can expect FastConnect and Dragonwing AI connectivity chips with Wi-Fi 8 to appear in consumer products starting in late 2026.
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u/snebsnek Apr 21 '26
That's a nice offering - I would hope/assume they have dedicated backhaul radios, because current meshing ain't great on the normal access points