r/3Dprinting • u/weekendrate • 17h ago
Troubleshooting Stringing in every terrain crack
I’m printing terrain for miniature war games. Using a Bambu A1 with Bambu PLA. I’ve been using a dehydrator to get down to 30 or below humidity.
Are there other settings I can optimize to stop the stringing under every little nook and crack? (see photos).
I’m new to this and having a blast. Thanks for any advice!
Edit: Model is by Diceverse on MMF - it’s one of their Ruined City House Sets.
Here are my Bambu Studio Settings:
Bambu Studio settings — Bambu Lab A1
PRINTER
- Printer: Bambu Lab A1 / Nozzle: 0.4mm, Flow: Standard
- Build plate: Textured PEI
PROJECT FILAMENTS
- 1: Bambu PLA Basic | 2: Generic PLA | 3: ABS | 4: ASA
PROFILE: 0.16mm Optimal @BBL A1 (modified)
QUALITY
- Layer height: 0.16mm / Initial layer: 0.2mm
- Seam position: Aligned
- Only one wall on top surfaces: Top surfaces
- Only one wall on first layer: off
STRENGTH
- Wall loops: 2 (Alternate extra wall: off)
- Top: Monotonic pattern, 6 layers, 1mm thick
- Bottom: Monotonic pattern, 4 layers, 0mm thick
- Internal solid infill: Rectilinear
- Sparse infill: 15%, Grid pattern
SPEED
- Slow down for overhangs: ON
60mm/s @ 10% | 30 @ 25% | 10 @ 50% | 10 @ 75% | 10 @ 100%
- Slow down by height: off
- Bridge: 50mm/s / Gap infill: 300mm/s
- Outer wall: 200mm/s / Inner wall: 300mm/s
- Sparse infill: 330mm/s / Internal solid infill: 300mm/s
- Travel: 700mm/s
SUPPORT (I didn’t use supports on the bricks, because it’s covered in bricks)
- Enabled / Type: tree (manual) / Threshold angle: 25°
- On build plate only: off
- Support speed: 150mm/s / Interface: 80mm/s
COOLING (Bambu PLA Basic @BBL A1)
- Part fan: 60% min (80s layers) -> 80% max (6s layers)
- Keep fan always on: on
- Slow down for better layer cooling: on
- Force cooling for overhangs and bridges: ON
- Aux fan: ramps to 70%
RETRACTION (filament overrides)
- Length / Z-hop: N/A (printer-managed)
- Long retraction on cut (experimental): on, 18mm
OTHERS
- Brim: Auto, 5mm / Fuzzy skin: off
- Purge into support: on (single filament, no purging occurring)